JPH0159741B2 - - Google Patents

Info

Publication number
JPH0159741B2
JPH0159741B2 JP56161329A JP16132981A JPH0159741B2 JP H0159741 B2 JPH0159741 B2 JP H0159741B2 JP 56161329 A JP56161329 A JP 56161329A JP 16132981 A JP16132981 A JP 16132981A JP H0159741 B2 JPH0159741 B2 JP H0159741B2
Authority
JP
Japan
Prior art keywords
package
lead
qip
semiconductor device
pitch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56161329A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5861654A (ja
Inventor
Tetsuo Akisawa
Hiroshi Iwami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP16132981A priority Critical patent/JPS5861654A/ja
Publication of JPS5861654A publication Critical patent/JPS5861654A/ja
Publication of JPH0159741B2 publication Critical patent/JPH0159741B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP16132981A 1981-10-09 1981-10-09 半導体装置 Granted JPS5861654A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16132981A JPS5861654A (ja) 1981-10-09 1981-10-09 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16132981A JPS5861654A (ja) 1981-10-09 1981-10-09 半導体装置

Publications (2)

Publication Number Publication Date
JPS5861654A JPS5861654A (ja) 1983-04-12
JPH0159741B2 true JPH0159741B2 (en]) 1989-12-19

Family

ID=15733009

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16132981A Granted JPS5861654A (ja) 1981-10-09 1981-10-09 半導体装置

Country Status (1)

Country Link
JP (1) JPS5861654A (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6281738A (ja) * 1985-10-07 1987-04-15 Hitachi Micro Comput Eng Ltd リ−ドフレ−ムおよびそれを用いた半導体装置
US5521427A (en) * 1992-12-18 1996-05-28 Lsi Logic Corporation Printed wiring board mounted semiconductor device having leadframe with alignment feature

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5521128A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame used for semiconductor device and its assembling
JPS55162252A (en) * 1979-06-05 1980-12-17 Nec Corp Semiconductor device
JPS55165654A (en) * 1979-06-12 1980-12-24 Nec Corp Semiconductor device sealed up with thin resin

Also Published As

Publication number Publication date
JPS5861654A (ja) 1983-04-12

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